EC812 Flexible Electronics
Course Name:
EC812 Flexible Electronics
Programme:
Category:
Credits (L-T-P):
Content:
Materials for Flexible Electronics: Two-dimensional materials, Nanowires and nanoparticles, transition metal oxides, amorphous thin films, polymeric semiconductors, paper-based electronics, textile substrates, barrier materials. Processes for Flexible Materials sand Devices: Thin-film Deposition and Processing Methods for Flexible Devices, CVD, ECVD, PVD, etching, photolithography, e-beam lithography, low-temperature process integration. Flexible Electronics Applications: Energy harvesting and storage components, Displays, sensor arrays, memory devices, MEMS, lab-on-a-chip, and photovoltaics, Introduction to Cost Models and Economics of Printed Flexible Electronics, Overview of display industry cost models, cost advantages and disadvantages for printed flexible electronics, scaling of large-area flexible systems, cost of goods sold for display applications.